MKS ASTRONhf+ AX7635 – 10: A High – Performance Plasma Generator

Product Overview

Technical Specifications

• Power Output: While specific power details for the AX7635 – 10 aren’t elaborated in the given data, other models in the ASTRONhf+ series, like the RPS22L with part number AX7635 – 02, suggest a high – power – handling capability. The device is likely designed to provide sufficient power to drive the plasma – generation process efficiently in industrial – scale applications.
• Frequency Range: As part of the ASTRONhf+ family, it operates within a high – frequency range, typically in the HF (high – frequency) band. This frequency range is optimized for generating the type of plasma required for applications such as CVD chamber cleaning and thin – film deposition processes, where precise control over plasma reactions is essential.
• Dimensions and Physical Design: Although no dimensional data is available, it is designed to be compact enough for integration into existing industrial equipment setups. The design likely takes into account factors such as ease of installation, access for maintenance, and compatibility with other components in a production line.
• Operating Conditions: The MKS ASTRONhf+ AX7635 – 10 is engineered to operate in standard industrial environments. It can withstand typical temperature and humidity ranges found in manufacturing facilities. However, for optimal performance, it is recommended to operate within the specified environmental limits provided in the product documentation.

Key Features and Benefits

• Reliable Plasma Generation: MKS has a reputation for manufacturing high – quality equipment, and the ASTRONhf+ AX7635 – 10 is no exception. It is designed to provide reliable and consistent plasma generation over extended periods. This reliability is crucial in industrial processes where even minor fluctuations in plasma quality can lead to product defects or inefficiencies. In semiconductor manufacturing, for example, consistent plasma generation is essential for achieving precise etching and deposition processes, ensuring the production of high – quality chips.
• Efficient Chamber Cleaning: One of the primary applications of the AX7635 – 10 is cleaning CVD process chambers. Its ability to generate atomic fluorine and effectively remove waste deposits makes it an efficient solution. The reduced wear and tear on the chamber due to this cleaning method not only extends the lifespan of the chamber but also reduces the frequency of chamber replacements, leading to increased productivity and cost savings for manufacturers.
• Compatibility with Industrial Processes: The ASTRONhf+ AX7635 – 10 is designed to be easily integrated into existing industrial production lines. It can work in tandem with other MKS components as well as equipment from other manufacturers. This compatibility allows for seamless integration into complex manufacturing setups, whether it’s a large – scale semiconductor fabrication facility or a smaller – scale thin – film deposition operation.
• Environmental Considerations: By generating new gases that can be readily scrubbed during the chamber – cleaning process, the AX7635 – 10 helps minimize the environmental impact of industrial operations. This is in line with the growing global focus on sustainable manufacturing practices, making it an attractive option for companies looking to reduce their environmental footprint.
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Related Models

• MKS ASTRONhf – s 15L RPS (AX7645PS – 01): This model, with its own unique specifications, is part of the MKS ASTRONhf product line. It may have different power ratings, frequency characteristics, or application – specific optimizations compared to the AX7635 – 10. While the AX7635 – 10 might be more focused on general – purpose plasma generation for a range of industrial processes, the ASTRONhf – s 15L RPS could be tailored for specific applications, such as certain types of reactive gas generation in a more specialized manufacturing process.
• MKS ASTRONhf+ RPS22L (AX7635 – 02): Similar to the AX7635 – 10, the RPS22L with part number AX7635 – 02 is also from the ASTRONhf+ series. It may have variations in power output or other performance parameters. The RPS22L could be designed for applications that require a slightly different power – handling capacity or have specific requirements for the plasma – generation process, such as in a different type of CVD chamber cleaning or a more demanding thin – film deposition application.
• MKS AX7610S Downstream Microwave Plasma Source: This is a different type of plasma source from MKS. Operating in the microwave frequency range compared to the HF operation of the ASTRONhf+ series, the AX7610S is designed for remote plasma applications with a replaceable sapphire plasma tube. It is ideally suited for more severe chemistries like CF4, CHF3, and NF3. In contrast to the AX7635 – 10, which may be more versatile in general industrial plasma applications, the AX7610S is specialized for applications where the unique properties of microwave – generated plasma and the use of these specific chemistries are required, such as in certain high – precision semiconductor manufacturing processes.

• BENTLY	3500/40-01-CN
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  BENTLY	3500/42-04-00
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